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ADVANCED ELECTRONICS COOLING.

Author(s) : ROBERTSON G. F.

Summary

INTEGRATED CIRCUITS HAVE CONTINUALLY BEEN MINIATURIZED TO INCREASE SPEED AND TO REDUCE THE SIZE OF ELECTRONIC SYSTEMS. INCREASED RELIABILITY AND REDUCED POWER CONSUMPTION HAVE ACCOMPANIED THESE IMPROVEMENTS. HOWEVER, MINIATURIZATION IS LIMITED AND REQUIRES REFRIGERATION. AS THE OPERATING TEMPERATURE IS REDUCED, BOTH THE SPEED AND THE RELIABILITY OF METAL-OXIDE SEMICONDUCTOR (MOS) DEVICES IS ENHANCED. A VARIETY OF TECHNOLOGIES EXIST TO PROVIDE COOLING OF MOS ELECTRONICS AT TEMPERATURES RANGING FROM 27 TO -197 DEG C. IT IS THE PURPOSE OF THIS PAPER TO REVIEW THE TECHNOLOGIES AVAILABLE AND TO DISCUSS THE APPLICATION OF THESE TECHNOLOGIES.

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Pages: 207-211

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Details

  • Original title: ADVANCED ELECTRONICS COOLING.
  • Record ID : 1992-2478
  • Languages: English
  • Source: New challenges in refrigeration. Proceedings of the XVIIIth International Congress of Refrigeration, August 10-17, 1991, Montreal, Quebec, Canada.
  • Publication date: 1991/08/10
  • Document available for consultation in the library of the IIR headquarters only.

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