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An experimental study on two-phase pressure drop and heat transfer characteristics of FC-72 in microchannels.

Author(s) : JANG Y. H., KIM B. S., KIM Y. C., et al.

Summary

The advance in electronic technology enables a large number of circuitry to be packed in small volume. Since the use of a finned heat sink to these electronic components is limited by manufacturing constraints and noise level, the use of liquid cooling is a promising way of maintaining low surface temperature by dissipating the large heat flux. In this study, the heat transfer and pressure drop characteristics of a microchannel heat exchanger, which was designed for liquid cooling of electronic components, were investigated by varying operating conditions and test geometries. FC-72 was used as a working fluid. The microchannel heat exchanger was made with rectangular shape having hydraulic diameters of 61.1 and 278.0 micrometers in regular intervals with a channel length of 250 mm. A direct heating method by a DC power supply was adapted to supply heat load to the test section. The heat flux provided by the direct heating method ranged from 0.6 to 45.1 kW/m2. The two-phase heat transfer rate from the heat source to the working fluid was measured, and two-phase pressure drop characteristics of the test section were also investigated.

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Pages: ICR07-B2-912

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Details

  • Original title: An experimental study on two-phase pressure drop and heat transfer characteristics of FC-72 in microchannels.
  • Record ID : 2008-0561
  • Languages: English
  • Source: ICR 2007. Refrigeration Creates the Future. Proceedings of the 22nd IIR International Congress of Refrigeration.
  • Publication date: 2007/08/21

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