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COOLING OF ELECTRONIC MODULES IN 19 INCH EQUIPMENT RACKS.

[In German. / En allemand.]

Author(s) : MAZURA P.

Type of article: Article

Summary

BOTH THE MINIATURIZATION OF ELECTRONIC COMPONENTS AND THE INCR EASED PACKING DENSITY, IN ELECTRONIC CABINETS, IMPLY THAT HEAT LOSSES WILL CONTINUOUSLY INCREASE. THE PROBLEM OF HEAT REJECTION BECOMES MORE AND MORE IMPORTANT AND IT BECOMES EVEN MORE SERIOUS WHEN IT IS ALSO NECESSARY TO PROTECT ELECTRONICS FROM MOISTURE AND DUST PARTICLES. SUCH SPACE MANAGEMENT IS INDISPENSABLE IF ONE WISHES TO ACHIEVE AN OPTIMAL OPERATING RELIABILITY. FREE AIR CIRCULATION MUST BE ENSURED BY ADEQUATE CONSTRUCTIONAL AND DESIGN MEASURES. THIS ARTICLE PRESENTS POSSIBLE METHODS OF CONSTRUCTION AND DEVICES FOR HEAT DISSIPATION SUITABLE FOR STANDARDIZED 19" RACK ASSEMBLIES AND PROVIDES A MATHEMATICAL BASE FOR CALCULATING THERMAL BALANCE.

Details

  • Original title: [In German. / En allemand.]
  • Record ID : 1991-0361
  • Languages: German
  • Source: Klima Kälte Heiz. - vol. 18 - n. 5
  • Publication date: 1990
  • Document available for consultation in the library of the IIR headquarters only.

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