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CRYOGENIC COOLING TECHNIQUES FOR LOW TEMPERATURE ELECTRONIC EQUIPMENT.

Author(s) : KERNEY P. J.

Summary

RECENT DEVELOPMENTS AND TECHNICAL BREAKTHROUGHS IN COOLED CMOS, HIGH TEMPERATURE SUPERCONDUCTIVITY AND GALLIUM ARSENIDE HAVE PROVIDED THE IMPETUS FOR UTILIZATION OF CRYOGENICALLY COOLED ELECTRONICS FOR A WIDE VARIETY OF APPLICATIONS. THESE APPLICATIONS ARE EMERGING IN BOTH THE MILITARY AND COMMERCIAL MARKETS. TO MEET THE CHALLENGES OF THIS DIVERSE APPLICATION SPECTRUM, A WIDE RANGE OF COOLING TECHNIQUES ARE AVAILABLE TO THE SYSTEM PACKAGING DESIGNERS. THE SELECTION OF A COOLING OPTION ENCOMPASSES A NUMBER OF TRADEOFFS WHICH ARE CLOSELY LINKED TO THE PACKAGE DESIGN AND THE SPECIFIC APPLICATION. THIS PAPER DESCRIBES THE TECHNIQUES FOR ACHIEVING CRYOGENIC TEMPERATURES, AS WELL AS CRITERIA ALLOWING TO CHOOSE THE BEST TECHNIQUE FOR A GIVEN APPLICATION.

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Pages: 212-216

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Details

  • Original title: CRYOGENIC COOLING TECHNIQUES FOR LOW TEMPERATURE ELECTRONIC EQUIPMENT.
  • Record ID : 1992-2039
  • Languages: English
  • Source: New challenges in refrigeration. Proceedings of the XVIIIth International Congress of Refrigeration, August 10-17, 1991, Montreal, Quebec, Canada.
  • Publication date: 1991/08/10
  • Document available for consultation in the library of the IIR headquarters only.

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