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Heat transfer in cooling system of microelectronics equipment with partially submerged condenser.

Author(s) : KABOV O. A.

Summary

The heat transfer during condensation in a liquid immersion cooling system of microelectronics equipment was tested. Inert dielectric liquid MD3F was used as a working fluid. The system reduced or avoided all of the influence of the non-condensable gas on heat transfer in the vapour space condenser. It was determined that the average heat transfer coefficient does not substantially decrease during the condensation of vapour on the partially submerged tubes due to the effect of the surface-tension-driven pressure gradient which occurs in the condensate film.

Details

  • Original title: Heat transfer in cooling system of microelectronics equipment with partially submerged condenser.
  • Record ID : 1996-3730
  • Languages: English
  • Source: International seminar and workshop on heat pipes, heat pumps, refrigerators and dual-use technologies. Preprints.
  • Publication date: 1995/09/12
  • Document available for consultation in the library of the IIR headquarters only.

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