IIR document

Improvement in water vapour sorption on inorganic salt-supported anodic alumina plate.

Author(s) : KUMITA M., WATANABE K., KOMORI H., et al.

Summary

In the authors' previous work, they proposed a calcium chloride-supported anodic porous alumina plate as a novel composite sorbent for water vapor sorption. This composite sorbent was prepared by electrolytic oxidation of aluminum plate and subsequent impregnation with calcium chloride. The authors obtained calcium chloride-supported anodic alumina plates with content up to 16.1 wt%, but their water uptakes were lower than that by the commercial silica gel. In this study, to improve water sorption performance of the calcium chloride-anodic alumina plate, meaning to increase the content of calcium chloride in the composite, the authors extend the processing conditions in preparation of anodic alumina films and impregnation with calcium chloride. Experimental results indicated that the film thickness and pore size of anodic alumina can be controlled by anodic oxidation conditions such as current density and processing time. Treatment of widening pores in the alumina films by using sulfuric acid after anodic oxidation is quite effective in promoting impregnation with calcium chloride. The impregnation temperature also influences the deposition of calcium chloride onto the alumina. Calcium chloride content in the anodic alumina plate reaches up to 56.1 wt%. The calcium chloride-alumina composites with content over approximately 30 wt% have higher water sorption capacity than the silica gel. Therefore, this composite plate is a promising sorbent for adsorption chillers and heat pumps using water as a working fluid.

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Details

  • Original title: Improvement in water vapour sorption on inorganic salt-supported anodic alumina plate.
  • Record ID : 30001254
  • Languages: English
  • Source: Sources/sinks Alternative to the Outside Air for Heat Pump and Air-conditioning Techniques (Alternative Sources - AS), Padua, Italy, April 5-7, 2011. / International Sorption Heat Pump Conference (ISHPC11), Padua, Italy, April 6-8, 2011.
  • Publication date: 2011/04/06

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