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MEASUREMENT OF THERMAL CONDUCTIVITY AND CONTACT RESISTANCE OF PAPER AND THIN-FILM MATERIALS.

Author(s) : SANDERS D. J., FORSYTH R. C.

Type of article: Article

Summary

A NEW CELL CAN MEASURE THE BULK THERMAL CONDUCTIVITY AND THE THERMAL CONTACT RESISTANCE OF PAPER AND OTHER THIN-FILM MATERIALS. BY MEASURING THE THERMAL RESISTANCE OF PAPER SAMPLES OF VARIOUS THICKNESSES, IT IS DEMONSTRATED THAT A PRESSURE OF 11.9 MPA EFFECTIVELY ELIMINATES THE THERMAL CONTACT RESISTANCE. BY COMPARING MEASUREMENTS AT ZERO AND MAXIMUM APPLIED PRESSURE, BOTH THE BULK CONDUCTIVITY AND THE CONTACT RESISTANCE CAN BE CALCULATED. IN ALL CASES, THERE IS A QUALITATIVE CORRELATION BETWEEN THE MEASURED CONTACT RESISTANCE AND THE SURFACE ROUGHNESS OF THE SHEET.

Details

  • Original title: MEASUREMENT OF THERMAL CONDUCTIVITY AND CONTACT RESISTANCE OF PAPER AND THIN-FILM MATERIALS.
  • Record ID : 1983-1722
  • Languages: English
  • Source: Rev. sci. Instrum. - vol. 54 - n. 2
  • Publication date: 1983
  • Document available for consultation in the library of the IIR headquarters only.

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