ShareThermal conductance of copper-copper and copper-silicon interfaces from 85 to 300 K.
Author(s) : YU J., YEE A. L., SCHWALL R. E.
Type of article: Article
Details
- Original title: Thermal conductance of copper-copper and copper-silicon interfaces from 85 to 300 K.
- Record ID : 1993-3282
- Languages: English
- Source: Cryogenics - vol. 32 - n. 7
- Publication date: 1992
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Indexing
- Themes: Thermodynamic measurements
- Keywords: Thermal conductivity; Copper; Measurement; Heat transfer; Silicon; Interface
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- Date : 1993/08
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- Source: Rev. sci. Instrum. - vol. 64 - n. 8
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- Date : 1993/11
- Languages : English
- Source: Rev. sci. Instrum. - vol. 64 - n. 11
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- Author(s) : SANDERS D. J., FORSYTH R. C.
- Date : 1983
- Languages : English
- Source: Rev. sci. Instrum. - vol. 54 - n. 2
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An analytical method for determining thermal co...
- Author(s) : MACDONALD R. A.
- Date : 1995/09
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 38 - n. 14
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- Author(s) : KUCHNIR M.
- Date : 1980/04
- Languages : English
- Source: Cryogenics - vol. 20 - n. 4
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