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Minichannel evaporator/heat pipe assembly for a chip cooling vapour compression refrigeration system.

Author(s) : RIBEIRO G. B., BARBOSA J. R. Jr, PRATA A. T.

Type of article: Article, IJR article

Summary

The authors investigate a novel evaporator design for a small-scale refrigeration system whose function is to assist the existing heat pipe technology currently used in chip cooling of portable computers. A heat transfer model for the evaporator/heat pipe assembly was devised specifically for sizing the evaporator in order to keep the chip surface temperature below a certain value. A prototype was tested with R600a at saturation temperatures of 45 and 55°C, mass flow rates between 0.5 and 1.5 kg/h and heat transfer rates between 30 and 60 W. The experimental results demonstrated that the average refrigerant-side heat transfer coefficient is more sensitive to a change in the refrigerant mass flux than to changes in the saturation temperature and heat transfer rate. The agreement between the calculated heat transfer coefficient and the data was within plus or minus 10% for the conditions evaluated.

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Pages: pp. 1402-1412

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Details

  • Original title: Minichannel evaporator/heat pipe assembly for a chip cooling vapour compression refrigeration system.
  • Record ID : 2010-1279
  • Languages: English
  • Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 33 - n. 7
  • Publication date: 2010/11

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