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Modelling of a power electronic components cooling system with a phase change material.

Author(s) : ARGOUD D., SARTRE V., LALLEMAND A.

Summary

The paper reports on modelling of a power electronic components cooling system using a phase change material. The developed transient state model is of a nodal type. A sensitivity analysis to the PCM thermophysical properties shows that the sheet temperature decreases with increasing liquid thermal conductivity and specific heat, latent heat of melting, density and with decreasing melting temperature. To enhance heat diffusion in the system, the addition of fins or the use of a metallic PCM is advantageous. For this application, the most suitable cooling system is a copper foam filled with a PCM like paraffin.

Details

  • Original title: Modelling of a power electronic components cooling system with a phase change material.
  • Record ID : 2000-0431
  • Languages: English
  • Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
  • Publication date: 1997/10/24
  • Document available for consultation in the library of the IIR headquarters only.

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