ShareTwo-phase heat exchangers applied to power electronics cooling.
Author(s) : MEYSENC L., RAËL S., SCHAEFFER C., BRICARD A.
Summary
Experiments have been performed to assess the feasibility of a micro two-phase heat exchanger applied to insulated gate bipolar transistor (IGBT) power components cooling. After a brief recall of the principal characteristics of IGBT, a methodology of an evaporator design is presented versus power electronics constraints, then the experimental measurements are compared to the predictions of the thermal and hydraulic performances with water and the inert fluorocarbon liquid (FC72) as coolant fluids.
Details
- Original title: Two-phase heat exchangers applied to power electronics cooling.
- Record ID : 2000-0434
- Languages: English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
- Publication date: 1997/10/24
- Document available for consultation in the library of the IIR headquarters only.
Links
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Indexing
- Themes: Other industrial applications
- Keywords: Two-phase flow; Electronics; Transistor; Cooling; Heat exchanger; Component
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- Date : 2006/01
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 49 - n. 1-2
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Single- and two-phase heat exchangers for power...
- Author(s) : GILLOT C., BRICARD A., SCHAEFFER C.
- Date : 2000/09
- Languages : English
- Source: Int. J. therm. Sci. - Rev. gén. Therm. - vol. 39 - n. 8
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Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
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Mini-tubes to cool electronic chips.
- Date : 1995
- Languages : English
- Source: New Sci. - vol. 145
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Thermal simulation of aluminum nitride heat spr...
- Author(s) : HAHN R., KAMP A, HOEHNE J., TÖPFER M., REICHL H.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
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