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Spray cooling of electronic components.

Author(s) : KHODABANDEH R., JONSSON F., HAN X., et al.

Summary

To provide reliable cooling with a package power density in the order of 100 W/cm2 and more it is necessary to use liquid cooling due to the limit of air-cooling. Spray cooling with phase change has been considered in industrial applications due to its extremely high heat removal capability at low wall superheat. Spray cooling can be achieved by spraying a heated surface with a liquid that is subcooled or is at saturation temperature. The testing system consists of a spray nozzle, heated surface, a test chamber, a condenser, connecting tubes and a pump. In the test chamber the fluid is sprayed at the heated surface causing it to evaporate. The vapour flows to the condenser, reject its heat there and the liquid is pumped again to the spray nozzle. A variable speed pump is used for circulation of the refrigerant. Volume flow rate is measured at various pump speeds, meanwhile, the saturation temperature, pressure before and after the pump and the temperatures at the corners and the middle of the 12.6 x 12.6 mm copper heater are measured. The pump has a maximum flow rate of 500 ml/min. It can work at max system pressure of 20 bar and max differential pressure 5.5 bars. The nozzle used for the test rig was from Spraying Systems Company and labelled 1/4 T-SS and TG-SS 0.5. FC-72, FC-87 and R-245fa are used as refrigerants.

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Pages: ICR07-B1-1391

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Details

  • Original title: Spray cooling of electronic components.
  • Record ID : 2008-0397
  • Languages: English
  • Source: ICR 2007. Refrigeration Creates the Future. Proceedings of the 22nd IIR International Congress of Refrigeration.
  • Publication date: 2007/07/21

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