IIR document
Thermal conductivity of refrigerant fluids: a new correlation for the compounds of the methane and ethane series in the liquid phase along the saturation line.
Author(s) : LATINI G.
Summary
The aim of this work is to propose a simple and general formula to calculate the thermal conductivity and containing only the reduced temperature and some specific parameters for the refrigerant fluids in the liquid phase along the saturation line. This choice leads to an empirical equation, simple and attractive in mathematical and geometrical terms. The value of the critical temperature is required, the knowledge of the density is avoided by a complete transformation of a formula previously proposed by the author for different organic families; the new formula is tested for over 30 refrigerant fluids belonging to the methane and ethane series. The investigated reduced temperature range is 0.30 to 0.99 (from the normal melting point to near the critical temperature, when the critical enhancement appears). The absolute mean and maximum deviations between calculated and experimental thermal conductivity data are usually less than 3% and 6% respectively in the reduced temperature range 0.30 to 0.96 (there is evidence in at least one case that the reduced temperature range can be enlarged up to 0.98). The experimental thermal conductivity data of the check are indicated for each compound. The new equation is proposed for all the refrigerant fluids of the methane and ethane series, and it can be used with acceptable mean deviations (5%) also for refrigerant fluids for which critical temperature is not available and few (also only one) experimental thermal conductivity data are available.
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Pages: 2009-5
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Details
- Original title: Thermal conductivity of refrigerant fluids: a new correlation for the compounds of the methane and ethane series in the liquid phase along the saturation line.
- Record ID : 2009-1925
- Languages: English
- Source: 3rd Conference on Thermophysical Properties and Transfer Processes of Refrigerants
- Publication date: 2009/06/23
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