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Twenty first century cooling solution: Microchannel heat sinks.

Author(s) : KADAM S. T., KUMAR R.

Type of article: Article, Review

Summary

Due to rapid evolution in a wide range of technologies in twentieth century, heat dissipation requirement has increased very rapidly especially from compact systems. There is an urgent need for high performance heat sinks to ensure the integrity and long life of these petite systems. Use of forced convection cooling has been limited by the requirement of the excessively high flow velocity and associated noise and vibration problems. Microchannel heat sink seems to be most reliable cooling technology due to its superior command over heat carrying capability. Understanding the flow boiling phenomena in microchannel heat sink experimentally and analytically has been topic of intense research in twenty first century. In this review paper, the experimental studies on flow visualization, pressure drop and heat transfer characteristics of microchannels presented by different researchers are summarized.
Some different flow patterns observed in microchannel geometry such as bubble nucleation in thin film, periodic variation of flow pattern, flow circulation, bubble suppression and cross-channel flow are explained briefly. The influence of vapour quality, heat flux, mass flux and channel geometry on pressure drop and heat transfer characteristics of microchannel are reported. Different correlations reported for single and two phase heat transfer characteristics are compared. The comparative analysis showed that
available single phase and two phase correlations are inconsistence and large variation is observed among these correlations for same channel geometry, fluid and operating condition. Different instabilities associated with microchannels are also briefly presented.

Details

  • Original title: Twenty first century cooling solution: Microchannel heat sinks.
  • Record ID : 30012448
  • Languages: English
  • Subject: Technology
  • Source: International Journal of thermal Sciences - vol. 85
  • Publication date: 2014/11
  • DOI: http://dx.doi.org/10.1016/j.ijthermalsci.2014.06.013

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