ShareBack to the future: liquid cooling. Data center considerations.
Author(s) : BEATY D., SCHMIDT R.
Type of article: Article
Summary
Computer servers are becoming smaller while semiconductor chips use increasing amounts of power. New datacom equipment exceeds 20 kW per server rack, with the result that datacom centers face average power densities in excess of 1500 W/m2 based on the area of the room housing the equipment. Because traditional air cooling of datacom centers is reaching its practical limit, liquid cooling is being explored to keep up with these performance gains.
Details
- Original title: Back to the future: liquid cooling. Data center considerations.
- Record ID : 2005-2840
- Languages: English
- Source: ASHRAE Journal - vol. 46 - n. 12
- Publication date: 2004/12
Links
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Indexing
- Themes: Other air-conditioning equipment
- Keywords: Electronics; Cooling; Component; Water circuit
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