Summary
This paper describes the fundamental physics underlying the operation of fixed and variable expansion devices, and summarizes results of the analyses performed to compare them. Almost all the design options failed to match a thermostatic expansion valve (TXV) system performance but for a few, the COP shortfall was less than 3% at outdoor ambient temperatures higher than 27°C. However at lower ambient temperatures the only configuration capable of matching TXV system performance employed a short tube orifice with low side receiver and internal heat exchanger.
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Pages: ICR07-E1-1330
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Details
- Original title: Designing systems to use simpler expansion devices.
- Record ID : 2007-2579
- Languages: English
- Subject: Technology, General information
- Source: ICR 2007. Refrigeration Creates the Future. Proceedings of the 22nd IIR International Congress of Refrigeration.
- Publication date: 2007/08/21
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EEV (electronic expansion valve) applications.
- Author(s) : LAZZARIN R., NORO M.
- Date : 2007/12
- Languages : English
- Source: Refrig. World - vol. 61 - n. 5
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Dispositivos de expansion desde el tubo capilar...
- Author(s) : ROSON-RODRIGUEZ F.
- Date : 1996/10/02
- Languages : Spanish
- Source: CAF '96. Conferencias presentadas en el Congreso Argentino del Frio.
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Expansieorganen-leverancierregister.
- Date : 1998/07
- Languages : Dutch
- Source: Koude & Luchtbehandeling - suppl.; poster; 1 tabl.
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Experimental comparison of electronic and therm...
- Author(s) : LAZZARIN R., NORO M.
- Date : 2008/01
- Languages : English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 31 - n. 1
- Formats : PDF
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Thermostatic expansion valves.
- Date : 2008
- Languages : English
- Source: Refrig. Air Cond., Serv. Eng. - summer; 32-33; fig.
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