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Development of a cooling system for high heat dissipation CPU with a miniature compressor.

[ In Korean. / En coréen.]

Author(s) : JEON D. S., KIM S. C., KIM Y. L.

Summary

At present, heat dissipation of desktop PC's CPU reaches about 130 W and it is expected that the heat dissipation could reach 300 W within the next few years. The aims of this paper are to present the development of cooling system for high heat dissipation CPU andto discuss its performance. The cooling system presented in this paper is a vapour compression cooling system similar to conventional refrigeration system. That is, it is composed of evaporator, condenser, expansion device and compressor. The compressor used in the cooling system is a rotary type miniature compressor by Aspen Co. Ltd. It has very small size compared to the conventional compressor which has same capacity. As a result of performance test, it is obtained that the cooling capacity is about 298 W and the surface temperature of CPU and thermal resistance of evaporator are 38.8 and 0.072°C/W respectively. The surface temperature of CPUand thermal resistance are significantly lower than those of conventional cooling systems. Therefore, the cooling system developed in this work can be a good candidate for a high heat dissipation CPU cooling system.

Details

  • Original title: [ In Korean. / En coréen.]
  • Record ID : 2009-1291
  • Languages: Korean
  • Source: The 3rd Korean Congress of Refrigeration.
  • Publication date: 2009/03/19

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