ShareLiquid cooling architectures for computer systems of high availability.
Author(s) : ELLSWORTH M. J., SCHMIDT R. R.
Summary
Heat dissipation levels for components within a computer electronics rack are increasing to the point where traditional air-cooling needs will no longer meet thermal management requirements. Liquid cooling at the component and/or rack level is going to be the logical choice to replace air cooling. This paper outlines the requirements that will have to be met (i.e., temperature, pressure, cleanliness, quality) and the liquid cooling system architectures that will be needed to maintain the high availability associated with the computer systems being cooled. Additionally, alternative ways to deal with liquid cooling at the facilities level are addressed.
Details
- Original title: Liquid cooling architectures for computer systems of high availability.
- Record ID : 2008-1775
- Languages: English
- Source: ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
- Publication date: 2007/06/23
Links
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Indexing
- Themes: Air conditioning in laboratories and industry
- Keywords: Electronics; Data centre; Chiller; Cooling; Air conditioning; Chilled water; Component; Water circuit
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- Date : 2005/04
- Languages : English
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- Date : 2006/06/25
- Languages : English
- Source: ASHRAE Transactions. 2006 Annual Meeting, Quebec City, Canada. Volume 112, part 2 + CD-ROM.
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- Author(s) : SCHMIDT R. R.
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- Languages : English
- Source: ASHRAE Transactions. 2004 Annual Meeting, Nashville, Tennessee, USA. Volume 110, part 2 + CD-ROM.
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- Author(s) : NAKAYAMA W.
- Date : 1987
- Languages : Japanese
- Source: Trans. JAR - vol. 4 - n. 2
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