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Airflow management in a liquid-cooled data center.

Author(s) : CADER T., WESTRA L., REGIMBAL K., et al.

Summary

This paper deals with electronics (server, rack, and facility levels). With increasing facility density levels, airflow management has become a major challenge and concern. Hot spots, air short-circuiting, and inadequate tile airflow are a few of the issues that are complicating airflow management. This paper focuses on a thermal management approach that simplifies facility airflow management in a cost-effective and efficient manner. The liquid-cooling solution employs spray modules that indirectly cool the processors and remove the processor heat load directly to the facility water and not the facility air. An infrared camera was used to measure the temperature distributions. [Reprinted with permission from ASHRAE. Copyright, 2006].

Details

  • Original title: Airflow management in a liquid-cooled data center.
  • Record ID : 2007-1262
  • Languages: English
  • Source: ASHRAE Transactions. 2006 Annual Meeting, Quebec City, Canada. Volume 112, part 2 + CD-ROM.
  • Publication date: 2006/06/25

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