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Effects of wall conduction and interface thermal resistance on the phase-change problem.

Author(s) : HWANG C. C., LIM S., SHEN L. F.

Type of article: Article

Summary

Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It was found that the solidification rate increases with decreasing wall-material interfacial thermal resistance or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.

Details

  • Original title: Effects of wall conduction and interface thermal resistance on the phase-change problem.
  • Record ID : 1995-0810
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 37 - n. 13
  • Publication date: 1994/09

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