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EVALUATION OF CORRELATIONS FOR NATURAL CONVECTION COOLING OF ELECTRONIC EQUIPMENT.

Author(s) : JOHNSON C. E.

Type of article: Article

Summary

FOR COMPLICATED PHYSICAL ARRANGEMENTS, THERMAL DESIGN INFORMATION HISTORICALLY HAS BEEN OBTAINED FROM EXPERIMENTATION. BY INTERPRETING EXPERIMENTAL DATA IN THE FORM OF NONDIMENSIONAL PARAMETERS, RESULTS CAN BE APPLIED TO SITUATIONS PHENOMENOLOGICALLY SIMILAR TO, BUT PHYSICALLY DIFFERENT FROM, EXPERIMENTAL CONDITIONS. EMPIRICALLY DERIVED NATURAL CONVECTION CORRELATIONS EXTRACTED FROM THE SCIENTIFIC LITERATURE ARE COMPARED WITH NONDIMENSIONALIZED DATA OBTAINED FROM PHYSICAL MODELS OF UNIFORMLY HEATED ELECTRONIC CIRCUIT CARDS VERTICALLY MOUNTED IN A FRAME. THE UNIVERSAL CORRELATIONS OF WIRTZ AND STUTZMAN AND BAR-COHEN AND ROHSENOW COMPARED QUITE WELL WITH EXPERIMENTAL DATA COLLECTED FROM ELECTRONIC EQUIPMENT. THE DESIGNER OR ANALYST CAN CONFIDENTLY USE THESE CORRELATIONS, OBTAINED PRIMARILY FROM IDEAL FLOW CHANNELS, TO ESTIMATE THE MAXIMUM AVERAGE TEMPERATURE RISE IN A VERTICAL BANK OF ELECTRONIC CIRCUIT BOARDS COOLED BY NATURAL CONVECTION.

Details

  • Original title: EVALUATION OF CORRELATIONS FOR NATURAL CONVECTION COOLING OF ELECTRONIC EQUIPMENT.
  • Record ID : 1987-1520
  • Languages: English
  • Source: Heat Transf. Eng. - vol. 7 - n. 1-2
  • Publication date: 1986
  • Document available for consultation in the library of the IIR headquarters only.

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