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Measurement of the thermal conductivity of Vespel SP-1 at low temperatures from 2 to 300 K.

Author(s) : LI X. Z., YANG H., CHENG K., DENNER H. D., CHENG P.

Summary

Vespel SP-1 has a low thermal conductivity as well as good mechanical properties and good machinability so that in many cases it has provided solutions to thermal and electrical requirements. In the paper, measurements of thermal conductivity of Vespel SP-1 in the temperature range from 2 up to 300 K are presented. The special technique of the sandwich arrangement of the two thin disc samples was adopted to measure the very low thermal conductivity of the material and to eliminate the influence of the contact thermal resistance between disc samples.

Details

  • Original title: Measurement of the thermal conductivity of Vespel SP-1 at low temperatures from 2 to 300 K.
  • Record ID : 1999-2043
  • Languages: English
  • Source: Cryogenics and refrigeration. Proceedings of ICCR '98.
  • Publication date: 1998/04/21
  • Document available for consultation in the library of the IIR headquarters only.

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