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Numerical computation of fluid flow and heat transfer in microchannels.

Author(s) : TOH K. C., CHEN X. Y., CHAI J. C.

Type of article: Article

Summary

Since the availability of microfabrication techniques, heat pump devices have been made more compact, leading to even higher heat fluxes. In the coming years, it is projected that these heat fluxes may exceed 100 W/cm². Air cooling techniques are unlikely to be able to meet the cooling needs of these high heat flux electronic packages. As a result, there is increased interest in microchannel liquid cooling techniques.

Details

  • Original title: Numerical computation of fluid flow and heat transfer in microchannels.
  • Record ID : 2003-0656
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 26
  • Publication date: 2002/12

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