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Influence of airflow bypass on the thermal performance and pressure drop of plate fin and pin fin heat sinks for electronics cooling.

Author(s) : JONSSON H., PALM B.

Summary

Tests have been performed in a wind tunnel with eight heat sinks of four different designs including plate fin heat sinks and pin fin heat sinks with circular, elliptical and square cross-sections. The cross-sectional area of the wind tunnel was varied over a wide range and the air velocity was varied from 1 through 4 m/s. A bypass correlation has been developed, describing the deviation in thermal performance and pressure drop for bypass cases as compared to cases with no bypass. The correlation contains a number of parameters which are individual for each heat sink.

Details

  • Original title: Influence of airflow bypass on the thermal performance and pressure drop of plate fin and pin fin heat sinks for electronics cooling.
  • Record ID : 2000-0429
  • Languages: English
  • Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
  • Publication date: 1997/10/24
  • Document available for consultation in the library of the IIR headquarters only.

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