ShareStatus and challenges in thermal design of electronic parts and systems.
Author(s) : LASANCE C. J. M.
Summary
Assessment of research conducted and challenges discussed four years after the lecture 'Thermal management of air-cooled electronic systems: new challenges for research' presented at the first Eurotherm Seminar in Delft, the Netherlands, in September 1993.
Details
- Original title: Status and challenges in thermal design of electronic parts and systems.
- Record ID : 2000-0432
- Languages: English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
- Publication date: 1997/10/24
- Document available for consultation in the library of the IIR headquarters only.
Links
See other articles from the proceedings (8)
See the conference proceedings
Indexing
- Themes: Other industrial applications
- Keywords: Electronics; Cooling; Research; Component
-
Dynamic cooling of a semiconductor by a contact...
- Author(s) : LIPNICKI Z., KRÓL F.
- Date : 2005/07
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 48 - n. 14
View record
-
Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
View record
-
Mini-tubes to cool electronic chips.
- Date : 1995
- Languages : English
- Source: New Sci. - vol. 145
View record
-
Heat transfer regime map for electronic devices...
- Author(s) : FUSHINOBU K., HIJIKATA K., KUROSAKI Y.
- Date : 1996/10
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 39 - n. 15
View record
-
Correlating equations for impingement cooling o...
- Author(s) : WOMAC D. J., INCROPERA F. P., RAMADHYANI S.
- Date : 1994/05
- Languages : English
- Source: J. Heat Transf. - vol. 116 - n. 2
View record