ShareSummary
The accurate prediction of temperature distribution is an important stage during the design of high power electronic modules. A simulation tool "The4Sim", was used to compute the temperature distribution of the dissipating sources and the multilayer substrate structure down to the heat sink or package surface. Several examples are discussed, which show the thermal analysis of aluminum nitride based packages for high power dissipating modules.
Details
- Original title: Thermal simulation of aluminum nitride heat spreaders for various advanced electronic packaging applications.
- Record ID : 2000-0430
- Languages: English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
- Publication date: 1997/10/24
- Document available for consultation in the library of the IIR headquarters only.
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Indexing
- Themes: Other industrial applications
- Keywords: Nitride; Electronics; Cooling; Aluminium; Heat exchanger; Component
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Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
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Two-phase heat exchangers applied to power elec...
- Author(s) : MEYSENC L., RAËL S., SCHAEFFER C., BRICARD A.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
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Status and challenges in thermal design of elec...
- Author(s) : LASANCE C. J. M.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
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Power electronics high performance air-cooled h...
- Author(s) : OLIET C., MULLEN D., HOELL K., COCHRANE N., PREISHUBER-PFLUEGL F., RIGOLA J., BOUTON M., PONTRUCHER M., CASTRILLO P., SCHILLACI E., SANTOS D., MCKAY C., HALIMIC E., FREISMUTH J.
- Date : 2021/05
- Languages : English
- Source: 2021 Purdue Conferences. 18th International Refrigeration and Air-Conditioning Conference at Purdue.
- Formats : PDF
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Influence of airflow bypass on the thermal perf...
- Author(s) : JONSSON H., PALM B.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
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