ShareSummary
The accurate prediction of temperature distribution is an important stage during the design of high power electronic modules. A simulation tool "The4Sim", was used to compute the temperature distribution of the dissipating sources and the multilayer substrate structure down to the heat sink or package surface. Several examples are discussed, which show the thermal analysis of aluminum nitride based packages for high power dissipating modules.
Details
- Original title: Thermal simulation of aluminum nitride heat spreaders for various advanced electronic packaging applications.
- Record ID : 2000-0430
- Languages: English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
- Publication date: 1997/10/24
- Document available for consultation in the library of the IIR headquarters only.
Links
See other articles from the proceedings (8)
See the conference proceedings
Indexing
- Themes: Other industrial applications
- Keywords: Nitride; Electronics; Cooling; Aluminium; Heat exchanger; Component
-
Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
View record
-
Mini-tubes to cool electronic chips.
- Date : 1995
- Languages : English
- Source: New Sci. - vol. 145
View record
-
Micro cooling systems for high density packaging.
- Author(s) : GROMOLL B.
- Date : 1998/10
- Languages : English
- Source: Rev. gén. Therm. - vol. 37 - n. 9
View record
-
Two-phase heat exchangers applied to power elec...
- Author(s) : MEYSENC L., RAËL S., SCHAEFFER C., BRICARD A.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record
-
Heat transfer regime map for electronic devices...
- Author(s) : FUSHINOBU K., HIJIKATA K., KUROSAKI Y.
- Date : 1996/10
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 39 - n. 15
View record