SharePerformance comparison of liquid-cooling with air-cooling heat exchangers for telecommunication equipment.
Author(s) : JEON J., KIM Y., CHOI J. M., et al.
Summary
Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In the study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers.
Details
- Original title: Performance comparison of liquid-cooling with air-cooling heat exchangers for telecommunication equipment.
- Record ID : 2007-0825
- Languages: English
- Source: ACRA-2006. Proceedings of the 3rd Asian conference on refrigeration and air conditioning.
- Publication date: 2006/05/21
Links
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Indexing
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Themes:
Heat transfer;
Air conditioning in laboratories and industry - Keywords: Electronics; Design; Cooling; Air; Expérimentation; Heat exchanger; Chilled water; Component
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- Date : 2005/12
- Languages : English
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- Author(s) : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 2007/06/23
- Languages : English
- Source: ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
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- Date : 2006/06/25
- Languages : English
- Source: ASHRAE Transactions. 2006 Annual Meeting, Quebec City, Canada. Volume 112, part 2 + CD-ROM.
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- Date : 2006/12
- Languages : English
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