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Transient analysis of an advanced absorption cooling device employing copper-sputtered silica-gel and water pair.

Author(s) : CHAKRABORTY A., SAHA B. B., NG K. S., et al.

Summary

This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30°C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 W per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60°C. Another noteworthy finding is that, the load surface temperature is able to achieve 20°C for the cooling capacity of 10 Watt/cm2.

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Pages: pp. 293-298

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Details

  • Original title: Transient analysis of an advanced absorption cooling device employing copper-sputtered silica-gel and water pair.
  • Record ID : 2009-2367
  • Languages: English
  • Source: ACRA-2009. The proceedings of the 4th Asian conference on refrigeration and air conditioning: May 20-22, 2009, Taipei, R.O.C.
  • Publication date: 2009/05/20

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