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Void fraction measurement of R454C refrigerant using capacitance sensors.

Number: 0451

Author(s) : KIM M., UEMURA Y., JEONG J., SAITO K.

Summary

Various low-global warming potential (GWP) refrigerants are being actively considered in response to global warming and carbon-neutral agendas. To replace low-GWP refrigerants, the flammability, coefficient of performance (COP), and refrigerant charging amount must be analyzed based on the thermal or hydrodynamic characteristics of the refrigerant. Void fraction is an essential parameter for understanding the charging amount of a refrigeration system and the COP. Therefore, newly introduced low-GWP refrigerants must be accurately measured and analyzed. The void fraction of the two-phase flow in a heat exchanger varies depending on the heat flux, heat transfer mode, and distribution design. Therefore, flexible and accurate void fraction measurements in heat exchangers under various conditions are required. Because conventional measurement methods, such as the quick-closing valve (QCV) method, present flexible measurement limitations, capacitance sensors can be used as an alternative. A capacitance sensor provides real-time and noncontact measurements based on the change in electrical capacitance of two-phase flows; additionally, it allows various shapes of heat exchangers with a simple physical configuration to be measured flexibly. However, the application of capacitance sensors to refrigerants has only been reviewed for pure refrigerants. Therefore, in this study, the void fraction of R454C is measured using a capacitance sensor designed for a smooth macroscale horizontal tube, and the results are analyzed. The measured void fraction results are compared and validated using the conventional QCV method.

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Pages: 8 p.

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Details

  • Original title: Void fraction measurement of R454C refrigerant using capacitance sensors.
  • Record ID : 30031613
  • Languages: English
  • Subject: Technology
  • Source: Proceedings of the 26th IIR International Congress of Refrigeration: Paris , France, August 21-25, 2023.
  • Publication date: 2023/08/21
  • DOI: http://dx.doi.org/10.18462/iir.icr.2023.0451

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