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Conjugate numerical investigation of small-scale flat plate capillary pumped loop evaporator.

Author(s) : WAN Z. M., LIU W., NAKAYAMA A.

Summary

Two-dimensional numerical model for the small-scale flat plate capillary pumped loop (CPL) evaporator is presented, which includes liquid and vapour flow, heat transfer and phase change in the porous wick structure and heat transfer in the fluid region and metallic wall. The entire evaporator is solved with SIMPLE algorithm as a conjugate problem. The shape and location of vapour-liquid interface are calculated and the influences of applied heat flux, liquid subcooling and metallic wall material on the evaporator performance are studied. The effect of heat conduction of side metallic wall on the performance of small-scale flat plate CPL evaporator is analyzed, and sidewall effect heat transfer limit is introduced to estimate the performance of capillary evaporator. Increasing the liquid subcooling can increases the sidewall effect heat transfer limit of evaporator.

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Pages: ICR07-B2-399

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Details

  • Original title: Conjugate numerical investigation of small-scale flat plate capillary pumped loop evaporator.
  • Record ID : 2008-0143
  • Languages: English
  • Source: ICR 2007. Refrigeration Creates the Future. Proceedings of the 22nd IIR International Congress of Refrigeration.
  • Publication date: 2007/08/21

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