Convective heat transfer from a multichip module with different chip spaces to PCM slurry flow in a rectangular channel.

Author(s) : CHOI M., CHO K.

Type of article: Article

Summary

The objective of the present study was to investigate the effect of a chip spacing in a multichip module on the cooling characteristics of phase change material slurry. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number.

Details

  • Original title: Convective heat transfer from a multichip module with different chip spaces to PCM slurry flow in a rectangular channel.
  • Record ID : 2003-1172
  • Languages: English
  • Source: JSME int. J., B - vol. 43 - n. 4
  • Publication date: 2000/11
  • Document available for consultation in the library of the IIR headquarters only.

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