ShareSummary
The objective of the present study was to investigate the effect of a chip spacing in a multichip module on the cooling characteristics of phase change material slurry. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number.
Details
- Original title: Convective heat transfer from a multichip module with different chip spaces to PCM slurry flow in a rectangular channel.
- Record ID : 2003-1172
- Languages: English
- Source: JSME int. J., B - vol. 43 - n. 4
- Publication date: 2000/11
- Document available for consultation in the library of the IIR headquarters only.
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Indexing
- Themes: Mass transfer
- Keywords: Two-phase heat carrier; Geometry; Electronics; Measurement; Heat transfer; Cooling; Convection; Component
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Numerical study of heat transfer in a laminar m...
- Author(s) : TEREKHOV V. I., PAKHOMOV M. A.
- Date : 2002/05
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 10
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Heat transfer enhancement by the chimney effect...
- Author(s) : AULETTA A., MANCA O., MORRONE B., et al.
- Date : 2001/11
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 44 - n. 22
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Effective boundary conditions for buoyancy-driv...
- Author(s) : KHANAFER K., VAFAI K.
- Date : 2002/06
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 12
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Forced convective air-cooling of simulated prin...
- Author(s) : TAM W. C., LEUNG C. W.
- Date : 1993
- Languages : English
- Source: Appl. Energy - vol. 46 - n. 3
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Le CO2 comme frigoporteur diphasique.
- Author(s) : DUMINIL M.
- Date : 1999/06
- Languages : French
- Source: Rev. gén. Froid - vol. 88 - n. 994
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