Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin films immersed in FC-72.

Author(s) : WEI J. J., HONDA H.

Type of article: Article

Summary

Experiments were performed to study the effects of the height and thickness of square micro-pin-fin on boiling heat transfer from silicon chips immersed in a pool of degassed or gas-dissolved FC-72.

Details

  • Original title: Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin films immersed in FC-72.
  • Record ID : 2004-1622
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 21
  • Publication date: 2003/10

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