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Heat transfer from a copper surface to liquid helium 3 below 1 K.

Author(s) : MAEDA M., SHIGEMATSU T., FUJII Y., BEPPU A., TAKEDA K., SHIGI T.

Summary

Characteristics of heat transfer from a flat copper surface to liquid helium 3 have been measured using a liquid helium-3 refrigerator below 1 K under saturated vapour pressure. The temperature difference between the copper surface and liquid helium 3 was measured precisely at steady state as a function of the heat flux. The detailed boiling curves of liquid helium 3 below 1 K were obtained.

Details

  • Original title: Heat transfer from a copper surface to liquid helium 3 below 1 K.
  • Record ID : 1999-2178
  • Languages: English
  • Source: Cryogenics and refrigeration. Proceedings of ICCR '98.
  • Publication date: 1998/04/21
  • Document available for consultation in the library of the IIR headquarters only.

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