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Influence of system pressure on the boiling heat transfer coefficient in a closed two-phase thermosiphon loop.

Author(s) : KHODABANDEH R., PALM B.

Summary

In recent years, heat generation from electronic components has been rapidly increasing. Natural and forced convection air-cooled heat sinks are not well suited for cooling the components generating the highest heat fluxes. Other methods are therefore sought. Recently, the use of thermosiphons has attracted attention as a simple and effective cooling system for high heat flux components. In a thermosiphon system, the heat is absorbed during boiling and transferred as heat of vaporization from the hot part to the cold part of the system, with relatively small temperature differences. The set-up used in this study consisted of a thermosiphon loop, including evaporator, condenser, downcomer and riser. The loop had three evaporators, connected in parallel, made from small blocks of copper (10 × 20 × 15) mm in which five vertical channels with diameters 1.5 mm and length 15 mm were drilled. Experimental results in terms of heat transfer coefficients at different system pressures and heat inputs are presented and compared with predictions of correlations from the literature. In all tests, isobutane was used as working fluid.

Details

  • Original title: Influence of system pressure on the boiling heat transfer coefficient in a closed two-phase thermosiphon loop.
  • Record ID : 2004-2743
  • Languages: English
  • Publication date: 2002/07
  • Source: Source: Int. J. therm. Sci./Proc. ExHFT-5, Thessaloniki
    vol. 41; n. 7; 619-624; fig.; tabl.; 15 ref.

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