IIR document
Influence of the indium thermal interface on the heat transfer in mechanical thermal switch at cryogenics temperature and external magnetic field.
Number: 0010
Author(s) : KOLESOV K., MASHIROV A., KUZNETSOV A., ALIEV A., SHAVROV V.
Summary
The aim of this work is to evaluate the influence of indium thermal interface 100 μm thick on the thermal contact resistance between copper cylindrical samples with a diameter and height of 15 mm. These copper samples (moving and stationary) represent a model of a mechanical thermal switch for use in magnetic cooling. The experiment was carried out inside a cryostat in a temperature range from 15 to 140 K and an ambient pressure of 1.1×10-2 – 4.5×10-3 Pa and external magnetic field up to 3 T. The contact force of pressing copper samples with an indium thermal interface was 300 kPa.
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Details
- Original title: Influence of the indium thermal interface on the heat transfer in mechanical thermal switch at cryogenics temperature and external magnetic field.
- Record ID : 30032618
- Languages: English
- Subject: Technology
- Source: 10th IIR Conference on Caloric Cooling and Applications of Caloric Materials
- Publication date: 2024/08/24
- DOI: http://dx.doi.org/10.18462/iir.thermag.2024.0010
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