Thermal profile of a high-density data centre: methodology to thermally characterize a data centre.
Author(s) : SCHMIDT R. R.
Summary
The heat dissipated by large servers and switching equipment is reaching levels that make it very difficult to cool these systems in data centers or telecommunications rooms. This paper describes the thermal profile of a 22.4 × 25.4 m data centre and the measurement techniques employed to fully capture the detailed thermal environment. Detailed measurements were taken in this data centre of electronic equipment power usage; perforated floor tile airflow; cable cutout airflow; computer room air conditioning airflow, temperatures and power usage; electronic equipment inlet air temperatures. In addition to these measurements, the physical features of the data centre were recorded such that a detailed CFD model could be employed to compare the results. The empirical as well as the flow modelling data are presented and compared.
Details
- Original title: Thermal profile of a high-density data centre: methodology to thermally characterize a data centre.
- Record ID : 2006-0420
- Languages: English
- Source: ASHRAE Transactions. 2004 Annual Meeting, Nashville, Tennessee, USA. Volume 110, part 2 + CD-ROM.
- Publication date: 2004
Links
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Indexing
- Themes: Air conditioning in laboratories and industry
- Keywords: Heat; Electronics; Data centre; Measurement; Equipment; Air conditioning; Component
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HVAC issues for data centres.
- Author(s) : PATTERSON M. K., STEINBRECHER R., MONTGOMERY S., et al.
- Date : 2005/04
- Languages : English
- Source: ASHRAE Journal - vol. 47 - n. 4
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Liquid cooling architectures for computer syste...
- Author(s) : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 2007/06/23
- Languages : English
- Source: ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
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Thermal profile of a high-density data center: ...
- Author(s) : SCHMIDT R., IYENGAR M., BEATY D., et al.
- Date : 2005
- Languages : English
- Source: ASHRAE Transactions. 2005 Annual Meeting, Denver, Colorado, USA. Volume 111, part 2 + CD-ROM.
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COOLING TECHNOLOGY FOR ELECTRONIC COMPUTERS.
- Author(s) : NAKAYAMA W.
- Date : 1987
- Languages : Japanese
- Source: Trans. JAR - vol. 4 - n. 2
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Die freie Kühlung bei der Klimatisierung von DV...
- Author(s) : RUSCHKOWSKI G.
- Date : 2001/04
- Languages : German
- Source: Kälte + Klimatechnik (Die) - vol. 54 - n. 4
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