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Loop thermosiphons for cooling of electronic systems.

Author(s) : KHRUSTALEV D.

Summary

Future electronic systems, including high-density desktop computers, 1-U multi-processor rack mounted servers, and telecommunications cabinets, will reach volumetric thermal densities beyond the limits of air cooling. Alternative cooling solutions need to be developed. The paper outlines future device level heat fluxes and thermal gradients, as well as thermal solutions required for the total system. One potential solution is a loop thermosiphon with capillary structures. The general operation of loop thermosiphons with capillary structures is reviewed, as well as their particularly attractive features as system level thermal solutions.

Details

  • Original title: Loop thermosiphons for cooling of electronic systems.
  • Record ID : 2003-1215
  • Languages: English
  • Source: Non-compression refrigeration and cooling. Proceedings of the Second International Workshop.
  • Publication date: 2001
  • Document available for consultation in the library of the IIR headquarters only.

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