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Optimisation of single and double layer counter flow microchannel heat sinks.

Author(s) : CHONG S. H., OOI K. T., WONG T. N.

Type of article: Article

Summary

As electronics technology has evolved to a microscale level, IC chips have been fabricated with denser circuit integration. This trend leads to higher power densities and more stringent temperature constraints in IC designs. The conventional cooling methods can no longer meet the highly demanding cooling requirement. Hence, innovative ways to overcome the ever-increasing heat removal rate have to be explored. This article presents the microchannel heat sink, introduced by Tuckermann and Pease as one of the ingenious ways of improving the heat removal rate effectively.

Details

  • Original title: Optimisation of single and double layer counter flow microchannel heat sinks.
  • Record ID : 2003-2749
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 22 - n. 14
  • Publication date: 2002/10

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