ShareAnalysis of microchannel heat sinks for electronics cooling.
Author(s) : ZHAO C. Y., LU T. J.
Type of article: Article
Details
- Original title: Analysis of microchannel heat sinks for electronics cooling.
- Record ID : 2004-0119
- Languages: English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 24
- Publication date: 2002/11
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Indexing
- Themes: Heat transfer
- Keywords: Electronics; Microchannel; Design; Cooling; Modelling; Miniaturization; Heat exchanger; Component
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Three-dimensional conjugate heat transfer in th...
- Author(s) : FEDOROV A. G., VISKANTA R.
- Date : 2000/02
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 43 - n. 3
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Three-dimensional numerical optimization of a m...
- Author(s) : RYU J. H., CHOI D. H., KIM S. J.
- Date : 2003/04
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 9
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Numerical optimization of the thermal performan...
- Author(s) : RYU J. H., CHOI D. H., KIM S. J.
- Date : 2002/06
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 13
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Single-phase liquid cooled microchannel heat si...
- Author(s) : ZHANG H. Y., PINJALA D., WONG T. N., et al.
- Date : 2005/07
- Languages : English
- Source: Applied Thermal Engineering - vol. 25 - n. 10
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Performance of a microchannel heat sink used in...
- Author(s) : SAIDI M. H., SALEHI M., KHIABANI R. H.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
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