Share

IIR document

R134a flow boiling inside a high porosity copper foam.

Number: pap. n. TP-037

Author(s) : DIANI A., MANCIN S., DORETTI L., et al.

Summary

Electronic cooling challenge is focused on the high heat flux to be dissipated by the operating fluid. More efficient heat spreaders and dissipators, and more compact heat exchangers are in great demand for various applications. In the last decade, cellular structure materials and particularly open-cell metal foams have been proposed as possible enhanced surfaces for both single phase and two phase heat transfer enhancement. It is well known that cooling with a boiling fluid can be efficient; therefore, its possible use for electronic thermal management can lead to a reliable electronic packaging. The paper presents the experimental measurements carried out during flow boiling heat transfer of R134a inside high porosity 5 PPI (pore per inch) copper foam, electrically heated from the bottom. The measurements have been carried out by varying the mass velocity and the vapor quality, at 30 °C of saturation temperature by imposing a heat flux of 50 kW m-2. The sample is tested in a new experimental facility built at the Dipartimiento di Ingegneria Industriale of the University of padova.

Available documents

Format PDF

Pages: 8 p.

Available

  • Public price

    20 €

  • Member price*

    Free

* Best rate depending on membership category (see the detailed benefits of individual and corporate memberships).

Details

  • Original title: R134a flow boiling inside a high porosity copper foam.
  • Record ID : 30008111
  • Languages: English
  • Source: 4th IIR Conference on Thermophysical Properties and Transfer Processes of Refrigerants
  • Publication date: 2013/06/17

Links


See other articles from the proceedings (69)
See the conference proceedings

Indexing