ShareSaturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip.
Author(s) : GENK M. S. el-, BOSTANCI H.
Type of article: Article
Details
- Original title: Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip.
- Record ID : 2004-0090
- Languages: English
- Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 10
- Publication date: 2003/05
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Indexing
- Themes: Mass transfer
- Keywords: Electronics; Chemical composition; Mass transfer; Heat transfer; Cooling; Dielectric property; Refrigerant; Boiling; Component
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Effusivity-based correlation of surface propert...
- Author(s) : ARIK M., BAR-COHEN A.
- Date : 2003/10
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 20
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Three-dimensional conjugate heat transfer in th...
- Author(s) : FEDOROV A. G., VISKANTA R.
- Date : 2000/02
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 43 - n. 3
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Thermally developing forced convection in a por...
- Author(s) : NIELD D. A., KUZNETSOV A. V., XIONG X.
- Date : 2003/02
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 4
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High performance miniature heat pipe.
- Author(s) : LIN L., PONNAPPAN R., LELAND J.
- Date : 2002/07
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 15
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Heat transfer enhancement by the chimney effect...
- Author(s) : AULETTA A., MANCA O., MORRONE B., et al.
- Date : 2001/11
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 44 - n. 22
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