High performance miniature heat pipe.
Author(s) : LIN L., PONNAPPAN R., LELAND J.
Type of article: Article
Summary
High performance miniature heat pipes are developed for the cooling of high heat flux electronics using new capillary structures made of a folded copper sheet fin. Various geometric shapes of the groove wick are tested. The heat pipe with partially opened groove wick performs better than that with fully opened groove wick. The condenser heat transfer coefficient is higher by 120% or greater in the case of the former wick type compared to the latter at an operating temperature of 110 °C. Heat fluxes higher than 140 W/cm² are achieved using concentrated heating modes.
Details
- Original title: High performance miniature heat pipe.
- Record ID : 2003-0660
- Languages: English
- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 15
- Publication date: 2002/07
Links
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Indexing
- Themes: Mass transfer
- Keywords: Heat pipe; Electronics; Capillarity; Mass transfer; Heat transfer; Cooling; Performance; Miniaturization; Component
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- Date : 2002/06
- Languages : English
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- Date : 2000/02
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- Source: International Journal of Heat and Mass Transfer - vol. 43 - n. 3
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- Date : 2002/06
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- Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 13
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- Date : 2003/04
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- Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 9
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- Author(s) : KAYA T., GOLDAK J.
- Date : 2006/08
- Languages : English
- Source: International Journal of Heat and Mass Transfer - vol. 49 - n. 17-18
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