ShareThermal characterization of electronic packages by double water jet impingement cooling.
Author(s) : ZUGARI M. R., DEGRAEVE C., VULLIERME J. J.
Summary
A test set-up enabled study of the influence of the injection parameters, the flow rate, the injection distance and the environment. The linear variation laws of the heat transfer coefficient in accordance with the flow rate are obtained. This cooling method was applied for characterising different components. The comparison of this method with a double cold plate contact method, made it possible to prove its efficiency.
Details
- Original title: Thermal characterization of electronic packages by double water jet impingement cooling.
- Record ID : 2000-0428
- Languages: English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
- Publication date: 1997/10/24
- Document available for consultation in the library of the IIR headquarters only.
Links
See other articles from the proceedings (8)
See the conference proceedings
Indexing
- Themes: Other industrial applications
- Keywords: Thermal property; Jet; Electronics; Measurement; Cooling; Water; Component
-
Status and challenges in thermal design of elec...
- Author(s) : LASANCE C. J. M.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record
-
Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
View record
-
Influence of airflow bypass on the thermal perf...
- Author(s) : JONSSON H., PALM B.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record
-
Thermal simulation of aluminum nitride heat spr...
- Author(s) : HAHN R., KAMP A, HOEHNE J., TÖPFER M., REICHL H.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record
-
Modelling of a power electronic components cool...
- Author(s) : ARGOUD D., SARTRE V., LALLEMAND A.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record