Superconducting electronic circuits.
Circuits électroniques supraconducteurs.
Author(s) : VILLEGIER J. C.
Summary
This article attempts to set an international standard in superconducting electronic circuits and describes the main technological progress as well as its applications and accessible markets. It deals in particular with the choices of the thin-layer material sectors, of the status and progress in terms of cooling, as well as the new components concepts. Rapid Single Flux Quantum logic is also introduced. Finally, the author presents a few examples of logical-integrated-circuit chips, allowing for the construction of small cooling systems, and projects such as the Nasa "Petaflop" computer or large data commutation systems developed in Japan.
Details
- Original title: Circuits électroniques supraconducteurs.
- Record ID : 2007-0050
- Languages: French
- Subject: Technology, General information
- Source: Sixth conference on cryogenics and superconductivity. Proceedings (comprising papers and posters)./ Sixièmes Journées de cryogénie et de supraconductivité. Recueil des présentations orales et posters.
- Publication date: 2000/05/16
Links
See other articles from the proceedings (38)
See the conference proceedings
-
LES PREMIERES RETOMBEES DE LA < NOUVELLE > SUPR...
- Author(s) : LAUNET E.
- Date : 1988
- Languages : French
- Source: Ber. Tech. Wiss./Rep. Sci. Technol. - n. 11
View record
-
Challenges in superconducting digital circuits.
- Author(s) : DUZER T. van
- Date : 2000
- Languages : English
- Source: Applied superconductivity 1999. 1. Large-scale applications. 2. Electronic applications.
View record
-
Cold computing has arrived!
- Author(s) : BRODY S.
- Date : 1998
- Languages : English
- Source: Supercond. Cryoelectron. - vol. 11 - n. 2
View record
-
AFRL space cryogenic technology research initia...
- Author(s) : ROUSH F., ROBERTS T.
- Date : 2006/06/14
- Languages : English
View record
-
Loop heat pipes.
- Author(s) : MAYDANIK Y. F.
- Date : 2005/04
- Languages : English
- Source: Applied Thermal Engineering - vol. 25 - n. 5-6
View record