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THE EFFECT OF AN ELECTRIC FIELD ON BOILING HEAT TRANSFER OF R11.

Author(s) : OGATA J.

Summary

THE TEST SECTION CONSISTED OF A HORIZONTAL COPPER PLATE AND SEVERAL ROWS OF 0.8 MM DIAMETER STEEL WIRES. THE NEGATIVE DC FIELD WAS APPLIED BETWEEN A COPPER PLATE AND ELECTRODE WIRES. TWO KINDS OF HEAT TRANSFER SURFACES WERE SELECTED: A POLISHED SURFACE AND A POROUS SURFACE. THE EXPERIMENTAL CONDITIONS WERE: SATURATION TEMPERATURE: ABOUT 298 K (25 DEG C) ; HEAT FLUX: 2,400-13,400 W/M2; APPLIED VOLTAGE: 0-26 KILOVOLTS. IN THE SMOOTHED SURFACE, THE NUMBERS OF BOILING BUBBLES DECREASED WITH AN ELECTRIC FIELD, BUT THE BOILING HEAT TRANSFER COEFFICIENT INCREASED ABOUT 3 TO 6 TIMES AS LARGE AS THAT WITHOUT AN ELECTRIC FIELD. IN THE POROUS SURFACE, AN ELECTRIC FIELD DID NOT ENHANCE HEAT TRANSFER.

Details

  • Original title: THE EFFECT OF AN ELECTRIC FIELD ON BOILING HEAT TRANSFER OF R11.
  • Record ID : 1988-1364
  • Languages: English
  • Publication date: 1986/09/01
  • Source: Source: Proc. int. Symp. Heat Mass Transf. Refrig. Cryog., Dubr.
    140-151; 14 fig.; 1 tabl.; 13 ref.
  • Document available for consultation in the library of the IIR headquarters only.

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