Thermal computations for electronics: conductive, radiative, and convective air cooling.
Author(s) : ELLISON G. N.
Type of monograph: Book
Summary
This book provides complete mathematical derivations and supplements formulae with design plots. It offers exercise solutions, lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book. It also addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction, discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems.
Extract from the table of contents: thermodynamics of airflow; forced flow in systems, ducts, extrusions, and pin fin arrays; buoyancy driven draft; forced convective heat transfer (components, ducts, extrusions, and pin fin arrays); natural convection heat transfer (plates, heat sinks); thermal radiation heat transfer; conduction (basics, spreading resistance); additional mathematical methods.
Details
- Original title: Thermal computations for electronics: conductive, radiative, and convective air cooling.
- Record ID : 30004407
- Languages: English
- Publication: Taylor & Francis, CRC Press - United states/United states
- Publication date: 2011
- ISBN: 9781439850176
- Document available for consultation in the library of the IIR headquarters only.
Links
- External links:
Indexing
-
Themes:
Heat transfer;
Other industrial applications;
Air conditioning in laboratories and industry - Keywords: Thermodynamics; Thermal conductivity; Radiation; Free convection; Electronics; Calculation; Heat transfer; Cooling; Plate; Case study; Flow; Forced convection; Convection; Air conditioning; Component
-
Mixed convection in rectangular cavities at var...
- Author(s) : GUO G., SHARIF M. A. R.
- Date : 2004/05
- Languages : English
- Source: International Journal of thermal Sciences - vol. 43 - n. 5
View record
-
Cooling solutions in an operational data centre...
- Author(s) : FAKHIM B., BEHNIA M., ARMFIELD S. W., et al.
- Date : 2011/10
- Languages : English
- Source: Applied Thermal Engineering - vol. 31 - n. 14-15
View record
-
Silicon microchannel cooling for high power chips.
- Author(s) : COLGAN E. G., FURMAN B., GAYNES M., et al.
- Date : 2006/12
- Languages : English
- Source: HVAC&R Research - vol. 12 - n. 4
View record
-
EVALUATION OF CORRELATIONS FOR NATURAL CONVECTI...
- Author(s) : JOHNSON C. E.
- Date : 1986
- Languages : English
- Source: Heat Transf. Eng. - vol. 7 - n. 1-2
View record
-
Measurements of air flow characteristics in a f...
- Author(s) : HU S. C., WU Y. Y., et al.
- Date : 1996/03
- Languages : English
- Source: Build. Environ. - vol. 31 - n. 2
View record