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Thermal management of high-heat-flux devices edifice: embedded droplet impingement for integrated cooling of electronics.

Author(s) : AMON C. H.

Summary

The presentation will first explore recent research developments for thermal management of high-heat-flux devices. These include detachable heat storage units, jet impingement, droplets and sprays, and phase-change cooling, heat pipes, capillary and gravity pumped loops. The effect of micro-manufacturing and MEMS (micro electro-mechanical systems) will be discussed as enabling technologies for some innovative cooling schemes recently proposed. In the second part of the presentation, the development of EDIFICE, embedded droplet impingement for integrated cooling of electronics, will be discussed. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 70-100 W/cm2, employing latent heat of these high heat removal rates.

Details

  • Original title: Thermal management of high-heat-flux devices edifice: embedded droplet impingement for integrated cooling of electronics.
  • Record ID : 2002-1620
  • Languages: English
  • Source: Thermal sciences 2000. Proceedings of the ASME-ZSITS International Thermal Science Seminar + CD-ROM.
  • Publication date: 2000/06/11
  • Document available for consultation in the library of the IIR headquarters only.

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