ShareCooling Systems of Power Semiconductor Devices – A Review.
Author(s) : GORECKI K., POSOBKIEWICZ K.
Type of article: Periodical article, Review
Summary
In this paper, a detailed review of contemporary cooling systems of semiconductor devices is presented. The construction and the principles of operation of selected components of passive and active cooling systems, as well as selected computer tools supporting the design of such systems, are described. The dependences of thermal parameters calculated using these tools on selected factors characterizing the used cooling systems, e.g., the dimensions of their components, are presented and discussed. Additionally, some results of measurements illustrating the influence of selected parameters on the thermal resistance of power MOSFETs mounted in different cooling systems are shown. The properties of selected cooling systems are compared, and it is shown that by changing the type of cooling system, it is possible to reduce the thermal resistance value of a power MOSFET even 20 times. The presented considerations can make the process of designing cooling systems more effective.
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Pages: 29 p.
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Details
- Original title: Cooling Systems of Power Semiconductor Devices – A Review.
- Record ID : 30030158
- Languages: English
- Subject: Technology
- Source: Energies - vol. 15 - n. 13
- Publishers: MDPI
- Publication date: 2022/07
- DOI: http://dx.doi.org/10.3390/en15134566
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Indexing
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Themes:
Two-phase secondary refrigerants (PCMs, ice slurries…);
Evaporators, condensers and other heat exchangers;
Other industrial applications;
Other refrigerating systems (desiccant cooling, thermoelectrics, thermoacoustics…) - Keywords: Semiconductor; Electronics; Review; Heat sink; Heat pipe; Thermosyphon; Liquid; Immersion; PCM; Thermoelectric cooling
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