Summary
The thermal contact resistance (TCR) of the substrate and component is an important parameter in cryogenic applications. In the paper, the laser photothermal method (LPM) is used to measure the TCR between copper and stainless steel 304. The LPM can complete the measuring in ten seconds, even to several seconds. The measurement results show that: (i) the TCR is inversely proportional to the temperature in the range of 20 K to 300 K; (ii) increasing of the contact pressure will decrease the TCR at pressure of 0.2 MPa to 0.68 MPa; (iii) the variation tendencies of the TCR with the contact pressure and contact force are in a substantial agreement.
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Details
- Original title: Experimental study of the thermal contact resistance at low-temperature.
- Record ID : 30002020
- Languages: English
- Source: Proceedings of the 23rd IIR International Congress of Refrigeration: Prague, Czech Republic, August 21-26, 2011. Overarching theme: Refrigeration for Sustainable Development.
- Publication date: 2011/08/21
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