IIR document
Fundamental study of adhesion of ice to cooling solid surface (discussion on influence of copper oxide layer on ice adhesion force).
Author(s) : MATSUMOTO K., MOROHOSHI M., TERAOKA Y.
Type of article: Article, IJR article
Summary
In many situations, ice often adheres to a cooling solid surface, frequently causing serious accidents. It is critical to clarify the mechanism of ice adhesion to the cooling surface in order to prevent ice adhesion. In a past study, the shearing stresses of two kinds of test plates with a copper surface having the higher thermal conductivity were measured. The shearing stress corresponds to ice adhesion force. Both shearing stresses were significantly different; however, the cause remains unclear. Therefore, this study focuses on an oxide layer as the main factor causing the difference of both shearing stresses; the influence of the oxide layer formed on shearing stress was discussed. And in the removal and reformation processes of the oxide layer, the time variation of the shearing stress was clarified. Moreover, the relationship between the state of the copper surface and the shearing stress was also clarified by surface analysis.
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Details
- Original title: Fundamental study of adhesion of ice to cooling solid surface (discussion on influence of copper oxide layer on ice adhesion force).
- Record ID : 2009-1978
- Languages: English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 32 - n. 6
- Publication date: 2009/09
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Indexing
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Themes:
Heat transfer;
Ice manufacture - Keywords: Oxide; Ice; Geometry; Copper; Microchannel; Surface tension; Coating (materials); Adhesion; Surface; Expérimentation
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